The increasing demand in the semiconductor industry highlights the crucial role of lead frames in electronic components. Among various manufacturing techniques, silver electroplating is a key process to ensure optimal performance and reliability of lead frames. This study investigates the influence of electroplating parameters on coating thickness by applying the design of experiment (DOE) methodology. The main objectives are to identify and validate the key electroplating parameters that influence silver coating thickness and to quantify their effects. A combination of Hull cell tests, DOE and analysis of variance (ANOVA) were used to evaluate the importance of parameters such as current density, plating time, silver concentration and plating temperature. The results show that current density and plating time are the most important factors affecting the coating thickness, as shown by their high F values and p values less than 0.05. While silver concentration and plating temperature also have an influence on layer thickness, their influence is comparatively less significant. This study establishes a clear relationship between electroplating parameters and coating thickness and provides valuable insights for process optimization in silver electroplating, which can improve the quality and efficiency of lead frame production.The increasing demand in the semiconductor industry highlights the crucial role of lead frames in electronic components. Among various manufacturing techniques, silver electroplating is a key process to ensure optimal performance and reliability of lead frames. This study investigates the influence of electroplating parameters on coating thickness by applying the design of experiment (DOE) methodology. The main objectives are to identify and validate the key electroplating parameters that influence silver coating thickness and to quantify their effects. A combination of Hull cell tests, DOE and analysis of variance (ANOVA) were used to evaluate the importance of parameters such as current density, plating time, silver concentration and plating temperature. The results show that current density and plating time are the most important factors affecting the coating thickness, as shown by their high F values and p values less than 0.05. While silver concentration and plating temperature also have an influence on layer thickness, their influence is comparatively less significant. This study establishes a clear relationship between electroplating parameters and coating thickness and provides valuable insights for process optimization in silver electroplating, which can improve the quality and efficiency of lead frame production.