6th Annual International Conference on Industrial Engineering and Operations Management

An Analysis on Process Parameters of Solder Jet Bonding to Increase the Shear Strength of Solder Joint in HGA

Krisada Asawarungsaengkul
Publisher: IEOM Society International
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Track: Statistics and Optimization
Abstract

This paper intends to improve the shear strength of lead-free solder joint produced by the solder jet bonding (SJB) process using Nd:YAG laser to melt the solder ball. Currently, SJB is one of the most important processes for head gimbal assembly (HGA) which is a component of the hard disk drive. SJB is used for connecting circuits on slider to circuit pads on suspension. In this process, shear strength of solder joint is a vital quality characteristic and it needs to be increased. The root cause analysis tools including Cause & Effect Diagram, Cause & Effect Matrix, and FMEA were employed to determine the potential key process input variables (KPIVs). These analysis yielded us eight potential KPIVs. Then, a single replicate of 28-2 fractional factorial design was also performed to determine the significant factors which affect the shear strength of solder joint. The statistical analysis and regression model were utilized to obtain the optimal process parameters. This optimal process parameters could significantly increase the shear strength of solder joint from 150 gram-force to 289 gram-force.

Published in: 6th Annual International Conference on Industrial Engineering and Operations Management, Kuala Lumpur, Malaysia

Publisher: IEOM Society International
Date of Conference: March 8-10, 2016

ISBN: 978-0-9855497-4-9
ISSN/E-ISSN: 2169-8767