3rd Asia Pacific International Conference on Industrial Engineering and Operations Management

Tracking Javanese Cultural Heritage through Augmented Reality and its Implications in Indonesian Language for Foreign Speakers (BIPA) Learning

0 Paper Citations
Track: Information Technology

The development of Information and Communication Technology (ICT) in cultural heritage (CH) shows a very large impact at this time. In particular, it is about cultural heritage development uses the Augmented Reality (AR) technology. This study aimed to digitize the aspects of Javanese cultures (traditional clothes, houses, and weapons) and its implications in learning of Indonesian Language for Foreigners (BIPA). This current research used Thiagarajan 4D research and development design. The research was conducted through four (4) stages namely define, design, develop, and disseminate stages. The Augmented Reality development implemented the virtual buttons on each marker. Some markers were designed by using the Vuforia Software Development Kit (SDK). The 3D Unity and the Vuforia Engine SDK were used as the platforms to develop Augmented Reality software. The 3D objects were designed using the 3D blender app to imitate the traditional clothing, houses, and the traditional weapons. The results showed that this product has good sensitivity and is proven to be able to imitate object images. In addition, this product has implications and is interesting to use in the intermediate-level of BIPA learning on the cultural aspect. This research is important to do in addition to maintain, preserve, digitize the cultural aspects, as well as introducing Indonesian culture to foreigners.



Cultural Heritage, Augmented Reality, BIPA Learning, Indonesian Language, Information and Communication Technology (ICT).

Published in: 3rd Asia Pacific International Conference on Industrial Engineering and Operations Management, Johor Bahru, Malaysia

Publisher: IEOM Society International
Date of Conference: September 13-15, 2022

ISBN: 978-1-7923-9162-0
ISSN/E-ISSN: 2169-8767