Track: Lean Six Sigma Competition
Bill of Materials (BOM) is what makes the final product of a semiconductor manufacturing company producing high value RF power devices. Any waste in materials will be translated in material variance that will be reflected in unfavorable financial results. From data gathered in overconsumption of bulk material report, one of the contributors of material variance is AuSn preform used in one of high value products of RF Power device for Mobile Broadband application. The goal of this paper is to reduce the material over consumption as per six sigma approach and that is baseline – 70% (baseline-entitlement). This quantitative approach for the goal of this project will be the basis for waste reduction initiative. The approach or methodology that will be used to reduce material overconsumption will be through Six Sigma DMAIC approach. This will cover Define, Measure, Analyze, Improve and Control phases necessary to set clear project goal (Define) until determination of potential X’s or potential causes of over consumption (Measure) until validation (Analyze) going to Improve phase and Control. The expected results after probing all sources of contributors of waste is to provide actions based on each potential causes and monitor the over consumption on weekly and monthly basis. This paper also aims to provide structural approach to prevent material wastage through appropriate controls.
Bill of Materials, Six Sigma, AuSn preform, DMAIC approach, Diebond